โ— OpenContract Notice ยท 16Supplies๐Ÿ‡ช๐Ÿ‡บ EU FundedAMP / GPATED 114/2026

UCC-2025-28 Supply, Delivery, Installation, Commission, Calibration, and Validation of Integrated X-ray Photoelectron Spectroscopy (XPS) System with Collocated Raman Spectroscopy Module for TNI, UCC

Contracting Authority

Publication (OJ)

Jun 16, 2026

Submission Deadline

Jul 16, 2026 12:00

Estimated Value

โ‚ฌ890,000

Contract Duration

12.0 months

Procedure Type

Open procedure

Buyer headquarters

Cork (T12 VH39) โ€” IE053

Description

Tyndall National Institute, University College Cork (UCC) invites tenders for the supply, delivery, installation, commissioning, and validation of an integrated X-ray Photoelectron Spectrometer (XPS) System with Collocated Raman Spectroscopy Module, comprising two primary components: (i) XPS Module: For chemical composition and electronic structure analysis of thin films (metal oxides and 2D materials) produced by Atomic Layer Deposition (ALD) facility within Europeโ€™s first beyond-2 nm System-on-Chip (SoC) pilot line. (ii) Raman Spectroscopy Module: For structural, vibrational, and stress analysis of the same thin-film materials (metal oxides and 2D materials) from the atomic layer processing facility. This fully integrated system will provide essential complementary surface and bulk characterisation capabilities for next-generation ALD materials research within the pilot line facility.

CPV Codes

380000003830000038400000385000003860000038433000

Lots (1)

LOT-0001UCC-2025-28 Supply, Delivery, Installation, Commission, Calibration, and Validation of Integrated X-ray Photoelectron Spectroscopy (XPS) System with Collocated Raman Spectroscopy Module for TNI, UCC
โ‚ฌ890,000

Tyndall National Institute, University College Cork (UCC) invites tenders for the supply, delivery, installation, commissioning, and validation of an integrated X-ray Photoelectron Spectrometer (XPS) System with Collocated Raman Spectroscopy Module, comprising two primary components: (i) XPS Module: For chemical composition and electronic structure analysis of thin films (metal oxides and 2D materials) produced by Atomic Layer Deposition (ALD) facility within Europeโ€™s first beyond-2 nm System-on-Chip (SoC) pilot line. (ii) Raman Spectroscopy Module: For structural, vibrational, and stress analysis of the same thin-film materials (metal oxides and 2D materials) from the atomic layer processing facility. This fully integrated system will provide essential complementary surface and bulk characterisation capabilities for next-generation ALD materials research within the pilot line facility.

38000000383000003840000038500000386000003843300012 months

Review procedures

Review body

The High Court of Ireland โ€” Dublin

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